Auras is one of the larger liquid cooling companies, and they were out at Computex 2025 showing off everything from robots down to cold plates. The company had both the upcoming Oak Stream platform for Intel as well as the AMD SP7 platforms. One that we saw, which was neat, is the Auras AMD SP7 cold plate for liquid cooling next-gen AMD CPUs.
Auras AMD SP7 Liquid Cooling Cold Plate for 600W CPUs Shown at Computex 2025
Among a display with various liquid cooling cold plates was the AMD SP7 setup flanked by Intel Birtch Stream-AP, NVIDIA GB200 NVL4, and AMD MI325 cold plates.
Spec wise, one of the more interesting aspects of this is that this is 120.1 by 100.6 by 22.3mm. That may seem large, but it is smaller than the upcoming Intel Oak Stream cold plate from Auras which was 156.0 by 107.5 by 24.2mm. We will talk about that cold plate in a future piece.
The cold plate is also rated for 600W performance at 1LPM.
We can also see the six points the coldplate is fixed to the socket and that this cooler is for a dual socket design. There was no motherboard, but Auras did a neat job showing mock-up server trays.
Final Words
AMD has not publicly discussed its SP7 platform in great detail at this point, but based on the fact that current generation EPYC CPUs are on SP5, this would be for a next-generation design. We expect the next-generation of server CPUs from vendors like Intel, AMD, and Ampere to use 16 channel memory and higher core counts. There are already public SP7 designs online from several cooler vendors, but this was the first time we have seen liquid cooling cold plates in-person
The big thing for SP7 isn’t just the increase in memory channels but hopefully an increase in the number of PCIe lanes. 128 lanes (plus an additional 8 lanes for platform services) is still a lot but there are use cases where more would be beneficial. Jumping to 272 lanes would permit AMD to incorporate 4 and 8 socket designs. Zen 6 and 7 based Epyc chips are not expected to bring huge increases in cores per socket but adding sockets would address this grow area as well as increase memory capacity for those data center niches. At this stage, I’d expect them to be PCIe 6.0 with CXL 3.0 as well.